Mitsui Kinzoku has officially concluded its participation at THECA 2026, held at the BITEC exhibition center in Bangkok, Thailand on 26 – 28 August 2026.
As Southeast Asia solidifies its position as a critical hub for global electronics supply chains, we were proud to present our industry-leading ultra-thin and low-loss copper foil technologies engineered for AI infrastructure, 5G, and high-speed data centers. The three-day event brought valuable opportunities to strengthen regional partnerships, engage with key ecosystem players, and discuss advanced PCB packaging solutions.
We extend our sincere gratitude to our clients, partners, and the many visitors who stopped by our booth. Mitsui Kinzoku remains committed to accelerating technological growth and localized support across the Asia-Pacific region.
